IEEE International Symposium on Personal, Indoor and Mobile Radio Communications
5–8 September 2023 // Toronto, ON, Canada

Technical Program Member List

Full name Affiliation
Abdeldjalil Aïssa-El-Bey IMT Atlantique
Hamed Al-Raweshidy University of Brunel
Masoud Alghoniemy University of Alexandria
John Anderson Lund University
Georgia Athanasiadou University of Peloponnese
Dragana Bajić University of Novi Sad
Luca Barletta Politecnico di Milano
Roc Berenguer TECNUN
Emil Björnson KTH Royal Institute of Technology
Vasile Bota Technical University of Cluj Napoca
Rafael Caldeirinha Polytechnic Institute of Leiria
Filipe Cardoso ESTSetubal/Polytechnic Institute of Setubal and INESC-ID
Pascal Chevalier CNAM
Wan Choi Seoul National University
Laurent Clavier Institut Mines-Telecom, IMT Nord Europe
Justin Coon University of Oxford
Krzysztof Cwalina Gdansk University of Technology
Agnieszka Czapiewska Gdansk University of Technology
Andreas Czylwik Universität Duisburg-Essen
Rodrigo de Lamare Pontifical Catholic University of Rio de Janeiro
Rui Dinis Faculdade de Ciências e Tecnologia, University Nova de Lisboa
Telmo Fernandes IPLeiria / Institute of Telecommunications
Mark Flanagan University College Dublin
Davy Gaillot University of Lille
Jean-Marie Gorce INSA-Lyon
Jeongseok Ha KAIST
Slawomir Hausman Lodz University of Technology
Haci Ilhan Yildiz Technical University
Muhammad Ali Imran University of Glasgow
Koji Ishibashi The University of Electro-Communications
Kohji Itoh Tokyo University of Science
Lukasz Januszkiewicz Lodz University of Technology, Institute of Electronics
Josep Jornet Northeastern University
Eduard Jorswieck Technische Universität Braunschweig
Jingon Joung Chung-Ang University
Ines Kammoun National Engineering School of Sfax
Jan Kelner Military University of Technology
Babak Hossein Khalaj Sharif University of Technology
Pawel Kryszkiewicz Poznan University of Technology
Witold Krzymień University of Alberta
Thomas Kürner Technische Universität Braunschweig
Michael Lentmaier Lund University
Chunguo Li Southeast University
Husheng Li Purdue University
Ying Li Institute of Microelectronics, Chinese Academy of Sciences
Hsin-Chin Liu National Taiwan University of Science and Technology
Lu Lu University of Chinese Academy of Sciences
Dongtang Ma National University of Defense Technology
Jarosław Magiera Gdansk University of Technology
Michail Matthaiou Queen’s University Belfast
Jan Mietzner Hamburg University of Applied Sciences (HAW)
Paulo Montezuma FCT-UNL
Wai Ho Mow Hong Kong University of Science and Technology
Mort Naraghi-Pour Louisiana State University
Shusuke Narieda Mie University
Derrick Wing Kwan Ng University of New South Wales
Kai Niu Beijing University of Posts and Telecommunications
Pål Orten Kongsberg Maritime
Hyuncheol Park KAIST
Piotr Rajchowski Gdańsk University of Technology
Christophe Roblin Telecom Paris – Institut Polytechnique de Paris
Armando Rocha University of Aveiro
Jaroslaw Sadowski Department of Radio Communication Systems and Networks, Gdansk University of Technology, Poland
Mamoru Sawahashi Tokyo City University
Rafael Schaefer Technische Universität Dresden
Li Sun Xi’an Jiaotong University
Yichuang Sun University of Hertfordshire
Emmeric Tanghe Ghent University
Reiner Thomä Ilmenau University of Technology
Theodoros Tsiftsis University of Thessaly
Mikko Valkama Tampere University
Demosthenes Vouyioukas University of the Aegean
Krzysztof Wesolowski Poznan University of Technology
Xin-Wei Yao Zhejiang University of Technology
Thomas Zemen AIT Austrian Institute of Technology GmbH
Shunqing Zhang Shanghai University
Tiankui Zhang Beijing University of Posts and Telecommunications
Fu-Chun Zheng Harbin Institute of Technology, Shenzhen
Mónica Aguilar Igartua UPC
Adrian Agustin Centre Tecnològic de Telecomunicacions de Catalunya (CTTC/iCERCA)
Wessam Ajib Université du Québec à Montréal
Angeliki Alexiou University of Piraeus
Tara Ali Yahiya Universite Paris Saclay
Noura Aljeri University of Ottawa
Ismail AlQerm University of Missouri St. Louis
Marco Araujo Capgemini Engineering
Farid Ashtiani Sharif University of Technology
Mohamad Assaad CentraleSupelec
Giacomo Bacci University of Pisa
Abdelmalik Bachir The National School of Artificial Intelligence
Leonardo Badia Università degli Studi di Padova
JaeJong Baek Arizona State University
Abhik Banerjee Swinburne University of Technology
Vo Nguyen Quoc Bao Posts and Telecommunications Institute of Technology
Jorge Baranda Centre Tecnològic de Telecomunicacions de Catalunya (CTTC/CERCA)
Alessandro Bazzi University of Bologna
Zdenek Becvar Czech Technical University in Prague
Marko Beko ULHT/UNINOVA
Boris Bellalta Universitat Pompeu Fabra
Paolo Bellavista University of Bologna
Luis Bernardo Faculdade de Ciências e Tecnologia – Universidade Nova de Lisboa
André-Luc Beylot University of Toulouse
Kaigui Bian Peking University
Fernando Boavida University of Coimbra
Gennaro Boggia Politecnico di Bari
Patrick-Benjamin Bök Weidmueller Group
Leonardo Bonati Northeastern University
Jean-Marie Bonnin Institut Mines Telecom / IMT Atlantique
Stefan Brueck Qualcomm CDMA Technologies
Eyuphan Bulut Virginia Commonwealth University
Enrico Buracchini Telecom Italia Lab
Chiara Buratti University of Bologna
Luisa Caeiro Escola Superior de Tecnologia de Setubal – Polytechnic Institute of Setubal
Lin Cai Illinois Institute of Technology
Yunlong Cai Zhejiang University
Carlos Calafate Universidad Politécnica de Valencia
Rui Campos INESC TEC and Faculty of Engineering, University of Porto
Pan Cao University of Hertfordshire
Augusto Casaca INESC-ID
Paolo Casari University of Trento
Cicek Cavdar KTH Royal Institute of Technology
Nan Cen Saint Louis University
Matteo Cesana Politecnico di Milano
Chin Choy Chai Toronto Metropolitan University
Xianfu Chen VTT Technical Research Centre of Finland
Harsha Chenji Ohio University
Konstantinos Christodoulopoulos University of Athens
Yun Won Chung Soongsil University
Estefania Coronado Universidad de Castilla-La Mancha
Salvatore D’Oro Northeastern University
Hamza Dahmouni INPT
Klaus David University of Kassel
Antonio De Domenico Huawei Technologies Co. Ltd., France Research Center
Matthieu De Mari Singapore University of Technology and Design
Luca De Nardis Sapienza University of Rome
Carl Debono University of Malta
Emrecan Demirors Northeastern University
Margot Deruyck Ghent University – IMEC
Apostolos Destounis Ericsson France
Harpreet Dhillon Virginia Tech
Mehmet Yunus Dönmez Ericsson Research
Rahman Doost-Mohammady Rice University
Qinghe Du Xi’an Jiaotong University
Andrzej Duda Grenoble Institute of Technology
Lorenzo Favalli University of Pavia
Daquan Feng Shenzhen University
Simon Fletcher Real Wireless Limited
Mauro Fonseca UTFPR
Zoraida Frias Universidad Politecnica de Madrid
Vasilis Friderikos King’s College London
Qiang Fu RMIT University
Rosario Garroppo University of Pisa
Vincent Gauthier Institut TELECOM; Telecom SudParis; SAMOVAR UMR
Abdul Ghafoor National University of Sciences and Technology
Yacine Ghamri-Doudane University of la Rochelle
Alireza Ghasempour University of Applied Science and Technology
Mona Ghassemian Principal Expert- Huawei Technologies
Carlo Giannelli University of Ferrara
Tolga Girici TOBB University of Economics and Technology
Athanasios Gkelias Imperial College London
Diogo Gomes Universidade de Aveiro
Salil Kanhere UNSW Sydney
Haeyoung Lee University of Hertfordshire
Valeria Loscrí Inria Lille-Nord Europe
Daniel Macedo Universidade Federal de Minas Gerais
Francesco Malandrino CNR-IEIIT
Pietro Manzoni Universitat Politècnica de València
Gaia Maselli Sapienza University of Rome
Noor-A-Rahim Md. University College Cork
Michele Polese Northeastern University
Francesco Restuccia Northeastern University
Peter Rost Karlsruhe Institute of Technology
Franck Rousseau Université Grenoble Alpes
Harlan Russell Clemson University
Jorge Sá Silva University of Coimbra
Claudio Sacchi University of Trento
Ramiro Samano-Robles Research Centre in Real Time and Embedded Systems
Konstantinos Samdanis Nokia Bell Labs
Konstantin Samouylov Peoples’ Friendship University of Russia
Juan Sanchez-Gonzalez Universitat Politecnica de Catalunya (UPC)
Cesar Santivanez Pontificia Universidad Catolica del Peru
Eirini Eleni Tsiropoulou University of New Mexico
Michelle Wangham University of Vale do Itajaí
Nadjib Achir University Sorbonne Paris Nord
Iwan Adhicandra Bakrie University
Petri Ahokangas University of Oulu
Timo Ali-Vehmas Nokia
Giuseppe Araniti University Mediterranea of Reggio Calabria
Takuya Asaka Tokyo Metropolitan University
Dragana Bajić University of Novi Sad
Nikolaos Bartzoudis CTTC
Gautam Bhanage Amazon
Kaigui Bian Peking University
Christos Bouras University of Patras
Enrico Buracchini Telecom Italia Lab
Lin Cai Illinois Institute of Technology
Lei Cao The University of Mississippi
Nan Cheng Xidian University
Harsha Chenji Ohio University
Stefano Chessa Universita’ di Pisa
Kwan-Wu Chin University of Wollongong
Hyun Kyu Chung ETRI
Luca Davoli University of Parma
Luis Del Carpio Ericsson Research
Panagiotis Demestichas University of Piraeus
Emrecan Demirors Northeastern University
Sanjay Dhar Roy National Institute of Technology Durgapur
Luis Diez University of Cantabria
Qinghe Du Xi’an Jiaotong University
Jiancun Fan Xi’an Jiaotong University
Telmo Fernandes IPLeiria / Institute of Telecommunications
Huei-Wen Ferng National Taiwan University of Science and Technology
Luca Foschini University of Bologna
Tomas Fryza Brno University of Technology
Deepak G c Lancaster University
Jie Gao Carleton University
Yue Gao Fudan University
Alberto García University of Cantabria
Matthieu Gautier Univ Rennes, CNRS, IRISA
Alireza Ghasempour University of Applied Science and Technology
Apostolos Gkamas University Ecclesiastical Academy of Vella of Ioannina
Burak Gorkemli ARGELA
Zhangyu Guan University at Buffalo
Jeongseok Ha KAIST
Yassine Hadjadj-Aoul University of Rennes
Stathes Hadjiefthymiades University of Athens
Matti Hämäläinen University of Oulu
Tao Han New Jersey Institute of Technology
Fredrik Harrysson RISE Research Institutes of Sweden
Sahar Hoteit University Paris-SACLAY
Yulin Hu RWTH Aachen University
Cheng Huang University of Waterloo
Xiaojing Huang University of Technology Sydney
Kohji Itoh Tokyo University of Science
Min Jia Harbin Institute of Technology
Chunxiao Jiang Tsinghua University, Beijing
Qi Jiang Hefei University of Technology
Charalampos Kalalas Centre Tecnològic de Telecomunicacions de Catalunya (CTTC)
Jamil Khan The University of Newcastle
Evgeny Khorov IITP RAS
Witold Krzymień University of Alberta
Pardeep Kumar Quaid-e-Awam University of Engineering, Scince & Technology, Nawabshah
Puneet Kumar SIoT Lab Santa Clara University
I-Wei Lai National Taiwan Normal University
Tuan Anh Le Middlesex University
Lei Lei University of Guelph
Baozhu Li Zhuhai Fudan Innovation Institute
Chunguo Li Southeast University
Junling Li Southeast University
Mushu Li University of Waterloo
Qihao Li Jilin University
Xi Li Beijing University of Posts and Telecommunications
Yunzhou Li Tsinghua University
Sian-Jheng Lin Huawei Technology Co. Ltd.
Thomas Little Boston University
Chenxi Liu Beijing University of Posts and Telecommunications
Dongxiao Liu University of Waterloo
Hongwu Liu Shandong Jiaotong University
Xuemeng Liu The University of Sydney
Yiliang Liu Xi’an Jiaotong University
Miguel López-Benítez University of Liverpool
José A. López-Salcedo Universitat Autònoma de Barcelona
Rongxing Lu University of New Brunswick
Nurul Mahmood University of Oulu
Ivo Maljevic TELUS
Michail Matthaiou Queen’s University Belfast
Pedro Merino University of Malaga
Angelos Michalas University of Western Macedonia
Jan Mietzner Hamburg University of Applied Sciences (HAW)
Konstantin Mikhaylov University of Oulu
Paulo Montezuma FCT-UNL
Antoni Morell Universitat Autonoma de Barcelona (UAB)
Simone Morosi University of Florence – CNIT
Sudarshan Mukherjee Indian Institute of Technology Guwahati
Sharan Naribole Apple Inc.
Sharan Naribole Apple Inc.
Keivan Navaie Lancaster University
Jimmy Nielsen Aalborg University
Hideki Ochiai Yokohama National University
Chikara Ohta Kobe University
Tamoghna Ojha SRM University-AP, Amravati, Andhra Pradesh
Eiji Okamoto Nagoya Institute of Technology
Yanjun Pan University of Arkansas
Panagiotis Papadimitriou University of Macedonia
Pangun Park Chungnam National University
Haixia Peng Xi’an Jiaotong University
Christian Prehofer DENSO Automotive Germany
Liping Qian Zhejiang University of Technology
Meng Qin Xidian University
Kaige Qu University of Waterloo
Wei Quan Beijing Jiaotong University
Alejandro Ramirez Siemens AG
Theofanis Raptis IIT-CNR
Kentaro Saito Tokyo Denki University
Joao Santos Virginia Tech
Neetesh Saxena Cardiff University
Gregor Schiele University of Duisburg-Essen
Shamik Sengupta University of Nevada, Reno
Hamed Shah-Mansouri Sharif University of Technology
Ibraheem Shayea Istanbul Technical University (ITU)
Weisen Shi Huawei Technologies Canada Co., Ltd.
Koushik Sinha Southern Illinois University Carbondale
Simone Soderi IMT School for Advanced Studies Lucca
Sun Songlin Beijing University of Posts and Telecommunications
Cormac Sreenan University College Cork
Giovanni Stea University of Pisa
Corneliu Eugen D. Sterian Polytechnic University of Bucharest
Martin Stusek Brno University of Technology
Ajmery Sultana Algoma University
Sapna Thapar Indian Institute of Technology Jammu
Dionysia Triantafyllopoulou Chemnitz University of Technology
Charalampos Tsimenidis Nottingham Trent University
Hongjin Wang Hunan University
Mea Wang University of Calgary
Ping Wang York University
Wenjin Wang Southeast University
Hong Wen UESTC
Risto Wichman Aalto University
Jianjun Wu Huawei Technologies Co., Ltd.
Wen Wu Peng Cheng Laboratory
Yuan Wu University of Macau
Jie Xu The Chinese University of Hong Kong (Shenzhen)
Wenchao Xu The Hong Kong Polytechnic University
Peng Yang Huazhong University of Science and Technology
Tingting Yang Dalian Maritime University
Kamya Yekeh Yazdandoost KDDI Research Inc
Zhisheng Yin Xidian University
Bin Yu Samsung Research Institute China – Beijing (SRC-B)
Sherali Zeadally University of Kentucky
Qing-An Zeng North Carolina A&T State University
Radovan Zentner University of Zagreb, Faculty of Electrical Engineering and Computing
Engin Zeydan Centre Tecnològic de Telecomunicacions de Catalunya (CTTC)
Heli Zhang Beijing University of Posts and Telecommunications
Ning Zhang University of Windsor
Yuan Zhang University of Electronic Science and Technology of China
Dongmei Zhao McMaster University
Zhongyuan Zhao Beijing University of Posts and Telecommunications
Kan Zheng Ningbo University
Conghao Zhou University of Waterloo
Haibo Zhou Nanjing University
Yong Zhou ShanghaiTech University
Amro Al-Said Ahmad Keele University
Tuncer Baykas Kadir Has University
Julian Cheng University of British Columbia
Mihaela I. Chidean Universidad Rey Juan Carlos
Luis Guijarro Universitat Politècnica de València
Rainer Iraschko TELUS
Kentaro Ishizu National Institute of Information and Communications Technology
Mingyue Ji University of Utah
Min Jia Harbin Institute of Technology
Nopphon Keerativoranan Tokyo Institute of Technology
Minseok Kim Niigata University
Jia Li Oakland University
Wenjie Li Paris Research Center, Huawei Technologies
Yang Li Shenzhen Research Institute of Big Data
Madhusanka Liyanage University College Dublin
Jan Mietzner Hamburg University of Applied Sciences (HAW)
Paulo Montezuma FCT-UNL
Sudarshan Mukherjee Indian Institute of Technology Guwahati
Keivan Navaie Lancaster University
Redha Radaydeh Texas A&M University-Commerce
Frank Rayal Xona Partners
Piotr Remlein Poznan University of Technology
Susana Sargento Instituto de Telecomunicações, Universidade de Aveiro
Koushik Sinha Southern Illinois University Carbondale
Sun Songlin Beijing University of Posts and Telecommunications
Heidi Steendam Ghent University
Martin Stusek Brno University of Technology
Yaping Sun Pengchen Laboratory
Evgenii Vinogradov Technology Innovation Institute
Chengwen Xing Beijing Institute of Technology
Xin-Wei Yao Zhejiang University of Technology
Rodolfo W. L Coutinho Concordia University
Peng Sun Duke Kunshan University
Maram Bani Younes University of Ottawa

2023 Patrons


  • Diamond

  • Huawei logo

    Diamond

  • TII logo

    Gold

  • Rohde & Schwarz logo

    Silver

  • FNTC & Testbed logo

    Exhibitor